Published 11-27-07
Submitted by IntertechPira
PORTLAND, ME - November 27, 2007 - IntertechPira has announced that the second annual international sustainable packaging world summit, Sustainability in Packaging, will be held March 11 - 13, 2008 at the Royal Plaza Hotel in Orlando, FL, US.
This international conference will bring together packaging manufacturers and converters, brand owners and packaging end users, material and machinery suppliers and academics, consultants, government representatives and researchers to discuss the key issues/opportunities that lay ahead for this global market. A major emphasis will be placed on bioplastics, consumers and supply chain, green design, metrics for sustainability, new materials and technologies, recycling and waste management.
Benefits of attending:
IntertechPira provides events, training, online information and publications across a wide range of zeitgeist issues and disruptive technologies affecting industry. Our 100% independent products are provided globally 24/7 and delivered by teams of independent experts at sites in Portland, US and London, UK through 20 specialized industrial platforms. Our core competencies are information on: research and product development, globalization and new markets; production methods; regulatory and compliance.
For more information or to request a complete conference brochure, please contact John Buss, IntertechPira, 19 Northbrook Drive, Portland, Maine 04105 US. Telephone: 207 781 9627, Fax: 207 781 2150, Email: john.buss@pira-international.com, URL: www.sustainability-in-packaging.com